Nondestructive adhesive bond strength testing using a pulsed laser
LSP Technologies has developed an innovative method for evaluating adhesive bond strength in bonded composite structures. Laser Bond Inspection (LBI) uses a pulsed laser to generate a controlled stress wave which interrogates the adhesive bond line. The strength of the stress wave is selected by adjusting laser parameters, and the nondestructive process detects weak bonds while leaving strong bonds unaffected.
This live webinar highlight from May 2017 outlines basic principles and applications of this revolutionary technology.